Device for making carbon nanotube array

ABSTRACT

A device for making a carbon nanotube array includes a chamber, a gas diffusing unit and a gas supplying pipe. The gas diffusing unit and the gas supplying pipe are in the chamber. The gas diffusing unit is a hollow structure and defines a hole and an outlet. The gas supplying pipe includes a first end and a second end opposite to the first end. The first end extends out of the chamber. The second end is in the chamber and connected to the hole.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is related to commonly-assigned application entitled,“METHOD FOR MAKING CARBON NANOTUBE ARRAY”, concurrently filed (Atty.Docket No. US62206); “METHOD FOR SEPARATING CARBON NANOTUBE ARRAY FROMGROWTH SUBSTRATE”, concurrently filed (Atty. Docket No. US62208);“METHOD FOR MAKING CARBON NANOTUBE ARRAY”, concurrently filed (Atty.Docket No. US62207). Disclosures of the above-identified applicationsare incorporated herein by reference.

FIELD

The present application relates to a method for making a carbon nanotubearray and devices for making the carbon nanotube array.

BACKGROUND

Carbon nanotubes can be composed of a number of coaxial cylinders ofgraphite sheets, and have recently attracted a great deal of attentionfor use in different applications, such as field emitters, chemicalsensors, and so on. The carbon nanotubes can be prepared by ChemicalVapor Deposition (CVD), Arc Discharge, or Laser Ablation. When a carbonnanotube array is grown on a growth substrate by the CVD method, thecarbon nanotube array adheres to the growth substrate and it isdifficult to separate the carbon nanotube array from the growthsubstrate. Furthermore, it is difficult to obtain an integrated carbonnanotube array by peeling the carbon nanotube array from the growthsubstrate using a knife or a tweezer, because the bonding force betweenthe carbon nanotubes and the growth substrate is strong.

What is needed, therefore, is to provide a method for making a carbonnanotube array and devices for making the carbon nanotube array that canovercome the above-described shortcomings.

Therefore, there is room for improvement in the art.

BRIEF DESCRIPTION OF THE DRAWINGS

Implementations of the present technology will now be described, by wayof example only, with reference to the attached figures, wherein:

FIG. 1 is a schematic view of a first embodiment of a device for makinga carbon nanotube array.

FIG. 2 is a schematic view of the first embodiment of a substrate.

FIG. 3 is a schematic view of the first embodiment of another substrate.

FIG. 4 is a schematic view of the first embodiment of a gas supplyingelement.

FIG. 5 is a schematic view of the first embodiment of connecting the gassupplying element with a substrate.

FIG. 6 is a schematic process flow of the first embodiment of a methodfor making the carbon nanotube array by using the device of FIG. 1.

FIG. 7 is a schematic view of a second embodiment of connecting a gassupplying element with a substrate.

FIG. 8 is a schematic view of a third embodiment of connecting a gassupplying element with a substrate.

FIG. 9 is a schematic view of a forth embodiment of connecting a gassupplying element with a substrate.

FIG. 10 is a schematic view of a fifth embodiment of connecting a gassupplying element with a substrate.

FIG. 11 is a schematic view of the fifth embodiment of a substrate.

DETAILED DESCRIPTION

It will be appreciated that for simplicity and clarity of illustration,where appropriate, reference numerals have been repeated among thedifferent figures to indicate corresponding or analogous elements. Inaddition, numerous specific details are set forth in order to provide athorough understanding of the embodiments described herein. However, itwill be understood by those of ordinary skill in the art that theembodiments described herein can be practiced without these specificdetails. In other instances, methods, procedures, and components havenot been described in detail so as not to obscure the related relevantfeature being described. The drawings are not necessarily to scale, andthe proportions of certain parts may be exaggerated to illustratedetails and features better. The description is not to be considered aslimiting the scope of the embodiments described herein.

Several definitions that apply throughout this disclosure will now bepresented.

The term “substantially” is defined to be essentially conforming to theparticular dimension, shape or other word that substantially modifies,such that the component need not be exact. For example, substantiallycylindrical means that the object resembles a cylinder, but can have oneor more deviations from a true cylinder. The term “comprising” means“including, but not necessarily limited to”; it specifically indicatesopen-ended inclusion or membership in a so-described combination, group,series and the like.

The disclosure is illustrated by way of example and not by way oflimitation in the figures of the accompanying drawings in which likereferences indicate similar elements. It should be noted that referencesto “an” or “one” embodiment in this disclosure are not necessarily tothe same embodiment, and such references mean at least one.

Referring to FIG. 1, a device 10 for making a carbon nanotube array in afirst embodiment includes a chamber 101, a gas supplying element 102located in the chamber 101, and a heater 22 used for heating the chamber101. The gas supplying element 102 includes a gas supplying pipe 103 anda gas diffusing unit 104 connected to the gas supplying pipe 103.

The chamber 101 can be formed by a material with stable chemicalproperties and high temperature resistance. In one embodiment, thechamber 101 is defined by a quartz tube. A flowmeter can be installed inthe chamber 101 to detect the flow of gas, or a piezometer can beinstalled in the chamber 101 to detect the pressure of the chamber 101.The chamber 101 can be connected to a vacuum pump to reduce the pressurein the chamber 101. The chamber 101 has an inlet opening and an outletopening.

The gas supplying pipe 103 is used for supplying gas to the gasdiffusing unit 104. The gas supplying pipe 103 has two opposite ends,one end of the gas supplying pipe 103 is in the chamber 101 andconnected to the gas diffusing unit 104, the other end of the gassupplying pipe 103 is defined as an inlet 105 and extends out of thechamber 101. The connection manner between the gas supplying pipe 103and the gas diffusing unit 104 is not limited, as long as gas can besupplied or diffused from the gas supplying pipe 103 to the gasdiffusing unit 104. The gas supplying pipe 103 can be integrated withthe gas diffusing unit 104. The gas supplying pipe 103 can also bedetachably connected to the gas diffusing unit 104.

The gas diffusing unit 104 is used for supporting a substrate 108 anddiffusing the gas to the chamber 101. The gas diffusing unit 104 is awayfrom the inlet 105 and in the chamber 101. Referring to FIGS. 4 and 5,the gas diffusing unit 104 is a hollow structure and includes a bottomwall 1042 and a sidewall 107. The sidewall 107 defines a hole 1048, andthe gas supplying pipe 103 can be inserted into the hole 1048. The gasdiffusing unit 104 defines a space 1047 and an outlet 106, and theoutlet 106 is opposite to the bottom 1042. The sidewall 107 and thebottom 1042 define the space 1047. The sidewall 107 can form a cube, acircle, or a trapezoid. Thus, the shape of the gas diffusing unit 104 isnot limited. In one embodiment, the shape of the gas diffusing unit 104is cubic. In one embodiment, the shape of the gas diffusing unit 104 iscylinder, the shape of the outlet 106 is circle, circular wafersubstrate 108 is placed on the gas diffusing unit 104 and cover thecircular outlet 106. As shown in FIG. 4, the sidewall 107 includes afirst sidewall 1043, a second sidewall 1045 opposite to the firstsidewall 1043, a third sidewall 1044, and a fourth sidewall 1046opposite to the third sidewall 1044. The first sidewall 1043 defines thehole 1048, and the gas supplying pipe 103 inserted into the hole 1048.The bottom wall 1042, the first sidewall 1043, the second sidewall 1045,the third sidewall 1044, and the fourth sidewall 1046 encircle the space1047. The first sidewall 1043, the second sidewall 1045, the thirdsidewall 1044, and the fourth sidewall 1046 form a cube. Thus, the shapeof the gas diffusing unit 104 is cubic. The gas from the inlet 105passes through the gas supplying pipe 103 and the gas diffusing unit 104to enter the inside of the chamber 101. The gas enters the inside of thechamber 101 from the outlet 106 of the gas diffusing unit 104. Referringto FIG. 5, the sidewall 107 is used for supporting the substrate 108.The gas diffusing unit 104 can be a semi-closed container. In oneembodiment, the gas diffusing unit 104 is a quartz boat.

The substrate 108 is suspended on the outlet 106 of the gas diffusingunit 104. The substrate 108 can be stuck on the sidewall 107 of the gasdiffusing unit 104 by an adhesive. The substrate 108 defines a pluralityof through holes 109. The shape of each through hole 109 is not limited,such as circle, square, triangle, diamond, or rectangle. The shapes ofthe plurality of through holes 109 can be different from each other.Each through hole 109 can be a circular hole, as shown in FIG. 2. Thediameter of the circular hole is in a range from about 10 nanometers toabout 1 centimeter. Each through hole 109 can be a strip hole, as shownin FIG. 3. The width of the strip hole is in a range from about 10nanometers to about 1 centimeter. When the substrate 108 is located onthe gas diffusing unit 104, the gas in the gas diffusing unit 104 canenter inside of the chamber 101 by passing through the outlet 106 of thegas diffusing unit 104 and the through holes 109 of the substrate 108.

The heater can be formed by carbon nanotubes or electrothermalresistance wires surrounding the periphery of the chamber 101 to heatthe chamber 101, so that the substrate 108 is heated. The heater canalso be a high-frequency furnace or a laser heater, to only heat thesubstrate 108. For example, the heater is disposed above or below thegas diffusing unit 104, only to heat the substrate 108 without heatingthe entire chamber 101, thereby saving energy.

Referring to FIG. 6, a method for making a carbon nanotube array by thedevice 10 of FIG. 1 includes one or more of the following steps:

S1, providing the substrate 108 having a first substrate surface and asecond substrate surface opposite to the first substrate surface,wherein the substrate 108 defines the plurality of through holes 109;

S2, depositing a catalyst layer 110 on the first substrate surface, toform a composite structure;

S3, placing the composite structure in the chamber 101; S4, supplying acarbon source gas and a protective gas to the second substrate surface,and heating the composite structure to a first temperature, wherein thecarbon source gas and the protective gas pass through the plurality ofthrough holes 109 to contact with the catalyst layer, to grow the carbonnanotube array on the first substrate surface; and

S5, stopping supplying the carbon source gas to the second substratesurface, changing a temperature of the carbon nanotube array to a secondtemperature, and supplying an oxygen containing gas to the secondsubstrate surface, wherein the oxygen containing gas passes through theplurality of through holes 109 to contact with and oxidize the carbonnanotube array.

During step S1, the substrate 108 is resistant to high temperature, doesnot react with the carbon source gas and the protective gas, and doesnot undergo atomic permeation. The material of the substrate 108 can besilicon, quartz, or the like. In one embodiment, the substrate 108 is asilicon wafer, a protective layer is formed on the silicon wafer, forexample, the protective layer is a silicon oxide layer, and thethickness of the silicon oxide layer ranges from about 1 nanometer toabout 1000 nanometers. The first substrate surface can be treated bymechanical polishing or electrochemical polishing, to ensure thesmoothness of the first substrate surface to meet the needs of growingthe carbon nanotube array. Each of the plurality of through holes 109extends from the first substrate surface to the second substratesurface.

During step S2, the thickness of the catalyst layer 110 ranges fromabout 1 nanometer to about 10 nanometers. In one embodiment, thethickness of the catalyst layer 110 ranges from about 1 nanometer toabout 5 nanometers. The catalyst layer 110 can be formed on the firstsubstrate surface by evaporation, sputtering, or chemical deposition.The material of the catalyst layer 110 can be iron, cobalt, nickel, oran alloy of any combination thereof. The catalyst layer 110 can furtherbe annealed, the annealing temperature ranges from about 200 degreesCelsius to about 400 degrees Celsius, and the annealing time ranges fromabout 8 hours to about 12 hours. After annealing the catalyst layer 110under an air atmosphere, the catalyst layer 110 can be oxidized to formmetal oxide, and the catalyst layer 110 can become uniformly distributedmetal oxide catalyst nanoparticles. The catalytic activity of thecatalyst nanoparticles is better than the catalytic activity of thecontinuous catalyst layer 110. In one embodiment, the material of thecatalyst layer 110 is iron, the thickness of the iron catalyst layer 110is about 2 nanometers, and the iron catalyst layer 110 is annealed at300 degrees Celsius for 10 hours under the air atmosphere.

If the catalyst layer 110 is deposited on the first substrate surface,the metal of the catalyst layer 110 may react with the silicon of thefirst substrate surface to form an alloy, and this alloy would affectthe activity of the catalyst layer 110. Thus, before the catalyst layer110 is deposited on the first substrate surface, a catalyst carrierlayer can be formed on the first substrate surface. Thus, the metal ofthe catalyst layer 110 cannot react with the first substrate surface,and the activity of the catalyst layer 110 would not be affected. Thematerial of the catalyst carrier layer can be aluminum (Al), aluminumoxide (Al₂O₃), silicon oxide (SiO₂), or magnesium oxide (MgO). Thethickness of the catalyst carrier layer ranges from about 1 nanometer toabout 10 nanometers. In one embodiment, the catalyst carrier layer is analuminum layer, and the thickness of the aluminum layer ranges fromabout 3 nanometer to about 7 nanometers. It is understood that thecatalyst layer 110 and the catalyst carrier layer do not cover eachthrough hole 109. The carbon source gas and the protective gas can stillenter the chamber 101 by passing through the plurality of through holes109 after forming the catalyst layer 110 and the catalyst carrier layer.

During step S3, in the chamber 101, the first substrate surface of thesubstrate 108 is away from the gas diffusing unit 104, the secondsubstrate surface of the substrate 108 is in direct contact with the gasdiffusing unit 104, and the substrate 108 covers the outlet 106.

During step S4, the carbon source gas and the protective gas aresupplied to the gas diffusing unit 104 from the gas supplying pipe 103,and the carbon source gas and the protective gas can be supplied to thesecond substrate surface of the substrate 108 by passing through theoutlet 106 of the gas diffusing unit 104. And then the carbon source gasand the protective gas enter inside of the chamber 101 and is in directcontact with the catalyst layer 110 by passing through the through holes109 of the substrate 108.

During step S4, the first temperature is the growth temperature of thecarbon nanotube array. The first temperature ranges from 600 degreesCelsius to 720 degrees Celsius. In one embodiment, the first temperatureranges from 620 degrees Celsius to 700 degrees Celsius. The compositestructure is heated to the first temperature under a protective gasatmosphere, and then the carbon source gas and the protective gasmixture is supplied into the chamber 101, so that the carbon nanotubearray is grown on the first substrate surface by chemical vapordeposition. The time for supplying the carbon source gas and theprotective gas mixture ranges from about 10 minutes to about 40 minutes.The protective gas is an inert gas or nitrogen. The carbon source gas isa hydrocarbon compound, such as acetylene, ethylene, methane, ethane, orthe like. During growing the carbon nanotube array on the firstsubstrate surface, the pressure in the chamber 101 ranges from about 2torrs to 8 torrs.

The carbon source gas, such as acetylene, is in direct contact with thecatalyst layer 110 and pyrolyzed into carbon units (—C═C— or C) andhydrogen (H₂) due to the catalysis of the catalyst layer 110. When thehydrogen diffuses to the surface of the metal oxide catalystnanoparticles, the metal oxide catalyst nanoparticles can be reduced tometal catalyst nanoparticles. Thus, the oxidized catalyst can be reducedand activated. Then, the carbon units are adsorbed on the surface ofcatalyst layer 110, thereby growing the carbon nanotube array on thefirst substrate surface of the substrate 108. In one embodiment, theprotective gas is nitrogen, the carbon source gas is acetylene, thefirst temperature is about 700 degrees Celsius, and the pressure of thechamber 101 is about 5 torrs.

When the carbon source gas enters the chamber 101 through the pluralityof through holes 109, the carbon source gas is in direct contact withthe catalyst layer 110 to grow the carbon nanotube array. Thus, thecarbon nanotube array can be grown on the first substrate surface of thesubstrate 108 without filling the carbon source gas in whole chamber101, reducing waste of the carbon source gas.

In addition, in the prior art, in order to increase the size of thecarbon nanotube array, a larger-sized substrate is generally used. Thus,it is difficult for the carbon source gas to sufficiently contact withthe catalyst in the middle of the first substrate surface of thesubstrate 108 when some carbon nanotubes grow to a certain height,causing the carbon nanotubes of the carbon nanotube array to havedifferent heights. However, in above method as shown in FIG. 6, thesubstrate 108 has the plurality of through holes 109, and the carbonsource gas can enter inside of the chamber 101 from the plurality ofthrough holes 109 and sufficiently contact with all of the catalyst onthe first substrate surface. Thus, the carbon nanotubes of the carbonnanotube array prepared by the method as shown in FIG. 6 have the sameheight.

The steps S5 is optional steps and can be omitted. In the step S5,stopping supplying the carbon source gas to the second substratesurface, changing the temperature of the carbon nanotube array to thesecond temperature, and supplying the oxygen containing gas to thesecond substrate surface includes the following steps:

S51, stopping supplying the carbon source gas to the second substratesurface, continuously supplying the protective gas to the secondsubstrate surface, and changing the temperature of the substrate 108 tothe second temperature;

S52, supplying the oxygen containing gas to oxidize the carbon nanotubearray, to form an oxidized carbon nanotube array; and

S53, stopping supplying the oxygen containing gas and reducing thetemperature of the oxidized carbon nanotube array.

During step S51, after growing the carbon nanotube array is finished,the supplying of the carbon source gas is stopped, and the supplying ofthe protective gas is continued. The second temperature can be in arange from about 500 degrees Celsius to about 800 degrees Celsius. Thecarbon nanotube array can be heated to the second temperature bychanging the temperature of the chamber 101 to the second temperature.The pressure in the chamber 101 is still in a range from about 2 torrsto about 8 torrs. In one embodiment, the pressure in the chamber 101 isabout 5 torrs.

During step S52, the oxygen containing gas can pass through the gassupplying pipe 103, the gas diffusing unit 104, and the through holes109 of the substrate 108 to enter the chamber 101, so that the carbonnanotube array is oxidized at the second temperature. The flow rate ofoxygen containing gas ranges from about 300 standard millimeters perminute (sccm) to 500 sccm. The oxygen containing gas can be pure oxygenor air. The reacting time between the carbon nanotube array and theoxygen containing gas is the time for oxidizing the carbon nanotubearray by the oxygen containing gas and defined as an oxidizing time, andthe oxidizing time is in a range from about 5 minutes to about 20minutes.

During step S53, after oxidizing the carbon nanotube array is finished,the supplying of the oxygen containing gas is stopped, and the supplyingof the protective gas is continued. The flow rate of the protective gascan be increased by providing more protective gas. After thetemperatures of the oxidized carbon nanotube array and substrate 108naturally fall below 400 degrees Celsius, the substrate 108 and theoxidized carbon nanotube array are slowly taken out of the chamber 101.

After step S5, the oxidized carbon nanotube array can further beseparated from the substrate 108. For example, after the substrate 108and the oxidized carbon nanotube array are taken out of the chamber 101,the oxidized carbon nanotube array can be separated from the substrate108 by just shaking the substrate 108. When the substrate 108 stands up,the oxidized carbon nanotube array separates from the substrate 108because of the weight of the carbon nanotube array itself. The oxidizedcarbon nanotube array can also be separated from the substrate 108 justby blowing on the oxidized carbon nanotube array, such as only blowingon the oxidized carbon nanotube array by mouth. Alternatively, theoxidized carbon nanotube array is more easily peeled from the substrate108 using a knife or a tweezers than the non-oxidized carbon nanotubearray. Furthermore, when the substrate 108 and the oxidized carbonnanotube array are taken out of the chamber 101, taking the substrate108 and the oxidized carbon nanotube array out of the chamber 101 cannottoo fast, and the speed of taking the substrate 108 and the oxidizedcarbon nanotube array out of the chamber 101 is greater than 0 cm/minand less than 100 cm/min. When the speed of taking the substrate 108 andthe oxidized carbon nanotube array out of the chamber 101 is greaterthan or equal to 100 cm/min, the oxidized carbon nanotube array can falloff the substrate 108.

In one embodiment, the chamber 101 is heated to 700 degrees Celsius, theflow rate of the oxygen containing gas is 500 sccm, the oxidizing timeranges from about 9 minutes to about 10 minutes, and the oxidized carbonnanotube array and the substrate 108 are naturally cooled to 350 degreesCelsius. In one embodiment, the chamber 101 is heated to 800 degreesCelsius, the flow rate of the oxygen containing gas is 300 sccm, and theoxidizing time ranges from about 5 minutes to about 7 minutes. In oneembodiment, the chamber 101 is heated to 500 degrees Celsius, the flowrate of the oxygen containing gas is 500 sccm, and the oxidizing timeranges from about 16 minutes to about 20 minutes. In one embodiment, theoxygen containing gas is supplied in the process of naturally reducingthe temperatures of the oxidized carbon nanotube array, the flow rate ofthe oxygen containing gas is 500 sccm, and the oxidizing time rangesfrom about 13 minutes to about 15 minutes.

The carbon nanotube array includes a plurality of carbon nanotubes. Eachcarbon nanotube includes a top end, a bottom end, and a middle portionbetween the top end and the bottom end. In the process of growing thecarbon nanotube array, for each carbon nanotube, first the top endgrows, then the middle portion grows, and finally the bottom end grows.At the later growth stage of the carbon nanotube array, the catalyticactivity of the catalyst layer 110 decreases, resulting in the bottomend having more defects than the top end and the middle portion. Whenthe oxygen containing gas is supplied to the carbon nanotube array, theoxygen containing gas can contact the top end, the bottom end, and themiddle portion of each carbon nanotube. However, it is easier for theoxygen containing gas to react with the bottom end than to react withthe top end and the middle portion, because the bottom end has moredefects than the top end and the middle portion. The reaction betweenthe oxygen containing gas and the bottom end produces carbon dioxide andweakens the bonding force between each carbon nanotube and the firstsubstrate surface of the substrate 108. The middle portion of eachcarbon nanotube only has a few defects, thus it is not easy for themiddle portion to react with the oxygen containing gas, thereby keepingthe integrity of the carbon nanotube array.

After the carbon nanotube array reacts with the oxygen containing gasfor a period of time, the bonding force between the bottom of eachcarbon nanotube and the first substrate surface weakens by oxidizing thebottom end. Thus, the bottom end of each carbon nanotube can beseparated from the substrate 108 just by simple mechanical vibration,such as just lightly shaking the substrate 108, just blowing on theoxidized carbon nanotube array, just tilting the substrate 108, justreversing the substrate 108, or lightly peeling with the knife or thetweezers. When the substrate 108 is tilted, an extending direction ofthe substrate 108 and a horizontal plane form an angle, and the angle islarger than or equal to 30 degrees. In one embodiment, the angle isequal to about 90 degrees. When the substrate 108 is tilted or reversed,the oxidized carbon nanotube array falls only by gravity. Thus, thestructure of the carbon nanotube array cannot be destroyed, and anintegrated carbon nanotube array can be obtained. Additionally, when thebottom end of each carbon nanotube is separated from the substrate 108,the catalyst layer 110 remains on the first substrate surface of thesubstrate 108. The carbon nanotube array contains a few catalyst metalparticles or does not contain the catalyst metal particles after beingseparated from the substrate 108, thereby improving the quality or thepurity of the carbon nanotube array.

The carbon nanotube array and the oxidized carbon nanotube array are thesame except for bottom ends. The bottom ends of the carbon nanotubearray are not be oxidized, and the oxidized carbon nanotube array areoxidized. Furthermore, the carbon nanotube array is a free-standingstructure. The term “free-standing” includes, but not limited to, thecarbon nanotube array that does not have to be supported by a substrate.For example, the free-standing carbon nanotube array can sustain theweight of itself when it is hoisted by a portion thereof without anysignificant damage to its structural integrity. So, if the free-standingcarbon nanotube array is placed between two separate supporters, aportion of the free-standing carbon nanotube array, not in contact withthe two supporters, would be suspended between the two supporters andyet maintain film structural integrity. The oxidized carbon nanotubearray is also a free-standing structure.

The oxidized carbon nanotube array separated from the substrate 108 isstill a free-standing structure.

The second temperature, the oxidizing time, and the flow rate of theoxygen containing gas are related to the quality of the carbon nanotubearray. When the quality of the carbon nanotube array is low, forexample, the carbon nanotube array contains many defects and amorphouscarbons, the second temperature can be appropriately decreased, theoxidizing time can be shortened, and the flow rate of the oxygencontaining gas can be decreased. When the quality of the carbon nanotubearray is high, for example, the carbon nanotube array substantially hasno impurity, the second temperature can be appropriately increased, theoxidizing time can be prolonged, and the flow rate of the oxygencontaining gas can be increased.

It can be understood that when the second temperature and the flow rateof the oxygen containing gas are constant, the oxidizing time cannot betoo long or too short, as long as the oxidized carbon nanotube array canseparated from the substrate 108 easily. When the oxidizing time is toolong, the carbon nanotube array is can be seriously damaged and theheight of the carbon nanotube array will be greatly reduced. When theoxidizing time is too short, separating the oxidized carbon nanotubearray from the substrate 108 can be difficult.

The oxygen containing gas can pass through the gas supplying pipe 103 toenter the gas diffusing unit 104, and pass through the gas diffusingunit 104 and the through holes 109 of the substrate 108 to enter thechamber 101. In the process of entering the chamber 101, the oxygencontaining gas contacts with and oxidizes the bottom end of each carbonnanotube. The oxygen containing gas can only contacts with and oxidizesthe bottom end of each carbon nanotube by controlling the time forsupplying the oxygen containing gas. Fox example, after oxidizing thebottom end of each carbon nanotube, the supplying of the oxygencontaining gas is stopped. Thus, the chances of reacting the middleportion and top end of each carbon nanotube with the oxygen containinggas can be reduced, reducing the loss of the carbon nanotube array andimproving the integrity of the carbon nanotube array.

In the prior art, the growth substrate for growing the carbon nanotubearray is a continuous structure, the size of the carbon nanotube arraygrown on the growth substrate is larger, and the size of the carbonnanotube film formed by pulling the carbon nanotube array is alsolarger. When the carbon nanotube film is acted as a transparentconductive layer of a touch panel, the carbon nanotube film often needsto be cut, thereby causing the damage of the carbon nanotube film andincreasing the production cost.

In the present invention, the substrate 108 includes a plurality ofthrough holes 109, and the plurality of through holes 109 divide thesubstrate 108 into a plurality of regions. The size of each regiondetermines the size of the carbon nanotube array and the size of thecarbon nanotube film. The desired carbon nanotube film can be pulleddirectly out of the carbon nanotube array on the corresponding region.The carbon nanotube film cannot be damaged because of being cut, therebyreducing the production cost.

Referring to FIG. 7, a gas supplying element 202 of a second embodimentis shown. The gas supplying element 202 is similar to the gas supplyingelement 102 of the first embodiment above except that each of at leastthe first sidewall 1043 and the second sidewall 1045 has a stair. Thestair is in the space 1047 and used for supporting the substrate 108.The stair is adjacent to one end of each of the first sidewall 1043 andthe second sidewall 1045. The substrate 108 can be located on and fixedby the stairs of the first sidewall 1043 and the second sidewall 1045.

Referring to FIG. 8, a gas supplying element 302 of a third embodimentis shown. The gas supplying element 302 is similar to the gas supplyingelement 202 of the second embodiment above except that each of at leastthe first sidewall 1043 and the second sidewall 1045 has a plurality ofstairs. The plurality of stairs can be used for supporting a pluralityof substrates 108 with different sizes, thereby meeting differentproduction needs.

Referring to FIG. 9, a gas supplying element 402 of a fourth embodimentis shown. The gas supplying element 402 is similar to the gas supplyingelement 102 of the first embodiment above except that the gas diffusingunit 204 further includes a plate 1041 covering the outlet 106, and theplate 1041 has a plurality of plate through holes 1049 spaced from eachother. The plate 1041 is used for supporting the substrate 108. Thematerial of the plate 1041 is not limited. In one embodiment, the plateis quartz mesh, and plurality of plate through holes 1049 is correspondto the plurality of through holes 109 of the substrate 108 one to one.The gas in the gas diffusing unit 204 can enter inside of the chamber101 by passing through the plurality of plate through holes 1049 of thegas diffusing unit 204 and the plurality of through holes 109 of thesubstrate 108.

Referring to FIG. 10, a gas supplying element 502 of a fifth embodimentis shown. The gas supplying element 502 is similar to the gas supplyingelement 102 of the first embodiment above except that the gas supplyingelement 502 includes a plurality of the substrates 108 spaced from eachother, and the length of each substrate 108 is greater than the width ofthe outlet 106. Each substrate 108 is across the outlet 106 and locatedon the gas diffusing unit 104. In one embodiment, the length directionof each substrate 108 is perpendicular to the length direction of theoutlet 106. Each of the plurality of through holes 109 is formed by thedistance between two adjacent substrates 108, as shown in FIG. 11. Thus,multiple independent carbon nanotube arrays can simultaneously beprepared.

The embodiments shown and described above are only examples. Even thoughnumerous characteristics and advantages of the present technology havebeen set forth in the foregoing description, together with details ofthe structure and function of the present disclosure, the disclosure isillustrative only, and changes may be made in the detail, including inmatters of shape, size and arrangement of the parts within theprinciples of the present disclosure up to, and including, the fullextent established by the broad general meaning of the terms used in theclaims.

Additionally, it is also to be understood that the above description andthe claims drawn to a method may comprise some indication in referenceto certain steps. However, the indication used is only to be viewed foridentification purposes and not as a suggestion as to an order for thesteps.

What is claimed is:
 1. A device for making a carbon nanotube array, thedevice comprising: a chamber; a gas diffusing unit in the chamber,wherein the gas diffusing unit is a hollow structure and defines aspace, a hole and an outlet; and a gas supplying pipe, wherein the gassupplying pipe comprises a first end and a second end opposite to thefirst end, the first end extends out of the chamber, and the second endis in the chamber and connected to the hole.
 2. The device of claim 1,wherein the gas diffusing unit comprises a bottom wall and a sidewall,the sidewall defines the hole, and the outlet is opposite to the bottomwall.
 3. The device of claim 2, wherein the sidewall forms a cube, acircle, or a trapezoid.
 4. The device of claim 2, wherein the sidewallis used to supporting a substrate having a plurality of through holes,and the substrate covers the outlet.
 5. The device of claim 1, whereinthe second end is inserted into the hole.
 6. The device of claim 1,wherein a shape of the gas diffusing unit is cubic.
 7. The device ofclaim 1, wherein the gas diffusing unit is a semi-closed containerintegrated with the gas supplying pipe.
 8. The device of claim 1,wherein the gas supplying pipe is a quartz tube, and the gas diffusingunit is a quartz boat.
 9. The device of claim 1, wherein the gasdiffusing unit comprises a first sidewall and a second sidewall oppositeto the first sidewall, each of the first sidewall and the secondsidewall has a stair, and the stair is inside of the space.
 10. Thedevice of claim 1, wherein the gas diffusing unit comprises a firstsidewall and a second sidewall opposite to the first sidewall, each ofthe first sidewall and the second sidewall has a plurality of stairs,and the plurality of stairs is inside of the space.
 11. The device ofclaim 1, wherein the gas diffusing unit further comprises a platecovering the outlet, and the plate defines a plurality of plate throughholes spaced apart from each other.
 12. The device of claim 11, whereinthe plate is a quartz sheet or a metal mesh.
 13. The device of claim 11,wherein the plate is used to supporting a substrate having a pluralityof through holes, and the plurality of plate through holes correspondsto the plurality of through holes one to one.
 14. A device for making acarbon nanotube array, the device comprising: a chamber; a gas diffusingunit in the chamber, wherein the gas diffusing unit defines an outletand comprises a bottom wall and a sidewall, the sidewall defines a hole,the bottom wall and the sidewall define a space, and the outlet isopposite to the bottom wall; and a gas supplying pipe, wherein the gassupplying pipe comprises a first end and a second end opposite to thefirst end, the first end extends out of the chamber, and the second endis in the chamber and connected to the hole.
 15. The device of claim 14,wherein the sidewall further comprises a plurality of stairs in thespace.
 16. The device of claim 14, wherein the gas diffusing unitfurther comprises a plate covering the outlet, and the plate defines aplurality of plate through holes spaced from each other.
 17. The deviceof claim 16, wherein the plate is a quartz sheet or a metal mesh. 18.The device of claim 14, wherein the gas supplying pipe is a quartz tube,and the gas diffusing unit is a quartz boat.